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Jixiang Dai

Dalian University of Technology

Huiying Rd

DaLian, LiaoNing, 116024

China

  • Dalian University of Technology

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Thermal shock resistance and failure mechanisms of SiCf/SiC joints reinforced by nano-network structure

Number of pages: 25 Posted: 10 Dec 2025
Meihan Ren, Xiao You, Han Luo, Xiaohu Li, Ruiqing Zhao, Xiaowu Chen, Jixiang Dai, Jinshan Yang, Xiangyu Zhang and Shaoming Dong
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Dalian University of Technology, Dalian University of Technology, affiliation not provided to SSRN, Dalian University of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
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Abstract:

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SiCf/SiC joints, Reaction bonding, Thermal shock resistance, Shear strength, Finite element analysis