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BiJia Li

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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73

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Scholarly Papers (2)

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1.

The effect of diamond wafer on heat transfer enhancement for the copper heat sink with high heat flux: simulation research

Number of pages: 58 Posted: 05 Jan 2026
Zilong Wang, Ming Liu, HaiTao Chen, Hua Zhang, Binlin Dou, tao yang and BiJia Li
University of Shanghai for Science and Technology, University of Shanghai for Science and Technology, affiliation not provided to SSRN, University of Shanghai for Science and Technology, University of Shanghai for Science and Technology - Shanghai Key Laboratory of Multiphase Flow and Heat Transfer in Power Engineering, Beijing Institute of Technology and affiliation not provided to SSRN
Downloads 65 (933,592)

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Copper heat sink, Diamond wafer, High heat flux, Single-phase immersion cooling, Numerical Simulation, Temperature uniformity

2.

Impact of Diamond Wafers on the Thermal Spreading and Heat Transfer Performance of Copper Heat Sinks

Number of pages: 57 Posted: 17 Apr 2026
Zilong Wang, Ming Liu, BiJia Li, Hua Zhang, Binlin Dou, tao yang and HaiTao Chen
University of Shanghai for Science and Technology, University of Shanghai for Science and Technology, affiliation not provided to SSRN, University of Shanghai for Science and Technology, University of Shanghai for Science and Technology - Shanghai Key Laboratory of Multiphase Flow and Heat Transfer in Power Engineering, Beijing Institute of Technology and affiliation not provided to SSRN
Downloads 8 (1,561,096)

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Copper heat sink, Diamond wafer, High heat flux, Single-phase immersion cooling, Numerical simulation, Temperature uniformity