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chuanjun wang

affiliation not provided to SSRN

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Enhancing the Microstructure and Mechanical Properties of NiV/Cu Diffusion-Bonded Joints via a Magnetron-Sputtered Ni Interlayer

Number of pages: 22 Posted: 20 Jan 2026
Jingyu Li, Jinghong Chen, Ming Wen, yunxiu Chao, yiqing Wang, chengqi Shi, Sixie Li and chuanjun wang
affiliation not provided to SSRN, affiliation not provided to SSRN, Kunming Institute of Precious Metals, Kunming Institute of Precious Metals, Kunming Institute of Precious Metals, affiliation not provided to SSRN, Kunming Institute of Precious Metals and affiliation not provided to SSRN
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Abstract:

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NiV target material, Ni interlayer, Diffusion bonding, Magnetron sputtering, Mechanical properties, Interfacial microstructure