Application of Multicore Processing and Volume Parallelization in EBPVD Process Simulated Using DSMC

6 Pages Posted: 22 Jan 2018

See all articles by Sameer Upadhye

Sameer Upadhye

L&T Heavy Engineering

Shreekar Ramesh

Indian Institute of Management (IIM), Ahmedabad, Students

Malay Shah

Siemens Ltd.

Mandar Tendolkar

Veermata Jijabai Technological Institute (VJTI) - Department of Mechanical Engineering

Jaya Mukherjee

Bhabha Atomic Research Centre

Date Written: December 21, 2017

Abstract

The present work is focused towards exploring the parallelization opportunities to extend the capability of available computational resources for analyzing larger control volumes and complex geometries for an Electron Beam Physical Vapour Deposition (EBPVD) process using Direct Simulation Monte Carlo technique. The work first establishes the efficacy of the model by comparing the simulated results with published experimental results for copper deposition in a vacuum chamber. The model is then extended to incorporate additional geometries and tracks the results of the copper deposition in an extension of the cubic chamber. The copper deposition in the extended geometry is simulated in two ways: initially by considering the entire volume as a single control volume and secondly by creating a virtual partition to divide the entire volume under consideration into two sub-control volumes which are simulated independently. The results obtained show that this independent treatment of the control volume gives comparable results thereby implying that large control volumes can be simulated by dividing them into smaller and more manageable sub-volumes, and simulating these sub-volumes independently. The paper further reports about employing object oriented programming techniques and multicore processing to support development and execution of the program.

Keywords: Direct Simulation Monte Carlo; Vacuum Technology; Thin-Film Deposition; Multicore Porcessing; Volume Parallelization; Copper; EBPVD

Suggested Citation

Upadhye, Sameer and Ramesh, Shreekar and Shah, Malay and Tendolkar, Mandar and Mukherjee, Jaya, Application of Multicore Processing and Volume Parallelization in EBPVD Process Simulated Using DSMC (December 21, 2017). International Conference on Advances in Thermal Systems, Materials and Design Engineering (ATSMDE2017). Available at SSRN: https://ssrn.com/abstract=3101270 or http://dx.doi.org/10.2139/ssrn.3101270

Sameer Upadhye (Contact Author)

L&T Heavy Engineering ( email )

North Block 1, Gate No 1, Saki Vihar Rd
Powai, Mumbai, Maharashtra 400072
India

Shreekar Ramesh

Indian Institute of Management (IIM), Ahmedabad, Students ( email )

Ahmedabad
India

Malay Shah

Siemens Ltd. ( email )

Mandar Tendolkar

Veermata Jijabai Technological Institute (VJTI) - Department of Mechanical Engineering ( email )

Matunga, Mumbai, Maharashtra
India

Jaya Mukherjee

Bhabha Atomic Research Centre ( email )

Mumbai, 400085
India

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