Fabrication of Microchannels on SS-304 and Copper by Wet Chemical Etching and Comparison of Topographies
5 Pages Posted: 12 Feb 2018
Date Written: December 21, 2017
Microchannels are becoming an integral part of microreactors as they possess high surface area to volume ratios. The microchannel topography is dictated by width, depth and undercut on channel. Microchannels of widths 220 and 370 micrometer were fabricated on stainless steel-304 (SS-304) and copper using wet chemical etching. This study shows that initial widths of opening substantially affected etch factor and the depth of etching. Higher etch factor of solution gives higher depth of channels. The values of etch rates and etch factors for channels of width 370 micrometer were more compared to that of channels of width 220 micrometer. In isotropic etching, after etching of certain depth, etching of side walls starts and causes undercutting. Unlike macro feature etching, where the disposal of precipitates is much easier, microchannel etching encounters difficulties which results in changed topography of the etched channels.
Keywords: Etch Factor, Etch Rate, Micro Channels, Wet Chemical Etching
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