Summary of the 7th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells

9 Pages Posted: 29 Mar 2018 Last revised: 20 Apr 2018

See all articles by Guy Beaucarne

Guy Beaucarne

Dow Silicones sprl

Gunnar Schubert

Konstanz University of Applied Science

Loic Tous

Interuniversity MicroElectronics Center - IMEC

Jaap Hoornstra

Independent

Date Written: April 15, 2018

Abstract

The 7th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells took place in October 2017. Through presentations and discussions, it was evident that progress in the field is continuing at a fast pace. The limits of screen printing metallization are being pushed further through innovations in screens and process to finger width below 40 µm while keeping high aspect ratio and industrial applicability, and new screen printing pastes enable the introduction of advanced cell structures. While there does not seem to be much push anymore towards using plated metallization in today’s mainstream cell technology, it is being further improved and used as a key enabler for future cell and module technologies for very high power PV panels. Passivated contacts is an intensively researched topic and progress was reported towards industrial implementation. In the field of cell interconnection, a drop-in replacement to SnPb solder was introduced, while emerging disruptive interconnection technologies were seen to progress well, particularly multiwire interconnection where key improvements in cost and durability have been achieved which are needed for wide adoption.

Keywords: Metallization, Silicon solar cells, Interconnection

Suggested Citation

Beaucarne, Guy and Schubert, Gunnar and Tous, Loic and Hoornstra, Jaap, Summary of the 7th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells (April 15, 2018). 7th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells, 2017. Available at SSRN: https://ssrn.com/abstract=3151953 or http://dx.doi.org/10.2139/ssrn.3151953

Guy Beaucarne (Contact Author)

Dow Silicones sprl ( email )

Parc Industriel, Zone C, Rue Jules Bordet
Seneffe 7180
Belgium

Gunnar Schubert

Konstanz University of Applied Science ( email )

Alfred-Wachtel-Straße 8
Konstanz, 78462
Germany

Loic Tous

Interuniversity MicroElectronics Center - IMEC ( email )

B-3001 Leuven
Belgium

Jaap Hoornstra

Independent ( email )

No Address Available

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