Summary of the 7th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
9 Pages Posted: 29 Mar 2018 Last revised: 20 Apr 2018
Date Written: April 15, 2018
The 7th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells took place in October 2017. Through presentations and discussions, it was evident that progress in the field is continuing at a fast pace. The limits of screen printing metallization are being pushed further through innovations in screens and process to finger width below 40 µm while keeping high aspect ratio and industrial applicability, and new screen printing pastes enable the introduction of advanced cell structures. While there does not seem to be much push anymore towards using plated metallization in today’s mainstream cell technology, it is being further improved and used as a key enabler for future cell and module technologies for very high power PV panels. Passivated contacts is an intensively researched topic and progress was reported towards industrial implementation. In the field of cell interconnection, a drop-in replacement to SnPb solder was introduced, while emerging disruptive interconnection technologies were seen to progress well, particularly multiwire interconnection where key improvements in cost and durability have been achieved which are needed for wide adoption.
Keywords: Metallization, Silicon solar cells, Interconnection
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