Performance Analysis of Pulsating Heat Pipe with 50% Filling Ratio and Varying Fluids for Cooling Microprocessor

Posted: 19 Apr 2019

See all articles by Shubham Kanungo

Shubham Kanungo

Institute of Engineering and Science, IPSA, Indore

Ashwini Joshi

IPS Academy, Institute of Engineering and Science

Date Written: April 18, 2019

Abstract

Thermal Management of electronic device is a contemporary issue in the research field. Pulsating heat pipes are relatively new entrants to the family as a cooling solution for electronic devices. In this paper, an attempt is made to analyze the copper tube heat pipe for 50% filling ratio with varying cooling fluids such as methanol, acetone & butanol. The Thermal design power (TDP) of the microprocessors is in the range of 65W to 350W and in the purview of current usage and miniaturization of electronic components as to embed more application, TDP is predicted to increase. In this analysis, characteristics of the thermal resistance and average evaporator temperatures for different heat input for various working fluids like methanol, acetone, and ethanol at 50% filling ratio have been determined.

Keywords: Pulsating Heat Pipe, Electronic Cooling, Thermal Design Power, Microprocessor

Suggested Citation

Kanungo, Shubham and Joshi, Ashwini, Performance Analysis of Pulsating Heat Pipe with 50% Filling Ratio and Varying Fluids for Cooling Microprocessor (April 18, 2019). Proceedings of Recent Advances in Interdisciplinary Trends in Engineering & Applications (RAITEA) 2019, Available at SSRN: https://ssrn.com/abstract=3374183

Shubham Kanungo (Contact Author)

Institute of Engineering and Science, IPSA, Indore ( email )

Institute of Engineering & Science,IPS Academy Kno
Indore, 452012
India

Ashwini Joshi

IPS Academy, Institute of Engineering and Science ( email )

201 Vaibhav apartment Amitesh Nagar Scheme no. 59
Indore, 452019
India

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