Performance Analysis of Pulsating Heat Pipe with 50% Filling Ratio and Varying Fluids for Cooling Microprocessor

Abstract

Thermal Management of electronic device is a contemporary issue in the research field. Pulsating heat pipes are relatively new entrants to the family as a cooling solution for electronic devices. In this paper, an attempt is made to analyze the copper tube heat pipe for 50% filling ratio with varying cooling fluids such as methanol, acetone & butanol. The Thermal design power (TDP) of the microprocessors is in the range of 65W to 350W and in the purview of current usage and miniaturization of electronic components as to embed more application, TDP is predicted to increase. In this analysis, characteristics of the thermal resistance and average evaporator temperatures for different heat input for various working fluids like methanol, acetone, and ethanol at 50% filling ratio have been determined.

Keywords: Pulsating Heat Pipe, Electronic Cooling, Thermal Design Power, Microprocessor