Metal-Graphene Hybrid Terahertz Metasurfaces Based on Bound States in the Continuum (Bic) and Quasi-Bic for Dynamic Near-Field Imaging

22 Pages Posted: 16 Oct 2021

See all articles by Fuyu Li

Fuyu Li

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices

Yuanxun Li

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices

Tingting Tang

Chengdu University of Information Technology

Yulong Liao

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices

Yongcheng Lu

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices

Rui Peng

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices

Qin Zhang

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices

Xinyan Liu

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices

Yang Luo

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices

Shengye Wang

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices

Qiye Wen

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices

Date Written: 2021

Abstract

The bound state in the continuum (BIC) and quasi-BIC are widely used in biosensing, lasers, and nonlinear optics due to their strong abilities of light-limiting and high-Q resonance. Most of the work is dedicated to achieving the goal of static conversion between BIC and quasi-BIC, but lacks sufficient attention to their dynamic continuous manipulation. To alleviate this situation, a type of graphene-metal hybrid metasurfaces for BIC and quasi-BIC of terahertz linearly polarized waves are proposed by combining the tunable properties of graphene with the C 2  asymmetry of the structure. The free continuous modulation can be achieved by the Fermi level driven by an external voltage. The transmission amplitude corresponding to the maximum radiation leakage is 0.13. The quasi-BIC can be actively modulated in the modulation range of 0.13 ~ 0.63, and the modulation depth is as high as 0.5. Based on this, the terahertz dynamic near-field imaging of five "UESTC" images with different contrasts is developed and demonstrated. All the features of the electric field intensity and arrow direction show good imaging results. This work provides a new way for the design of terahertz modulators based on metasurfaces, and enriches the applications of BIC and quasi-BIC.

Keywords: BIC and quasi-BIC, dynamic, continuous modulation, metasurface, terahertz, near-field imaging

Suggested Citation

Li, Fuyu and Li, Yuanxun and Tang, Tingting and Liao, Yulong and Lu, Yongcheng and Peng, Rui and Zhang, Qin and Liu, Xinyan and Luo, Yang and Wang, Shengye and Wen, Qiye, Metal-Graphene Hybrid Terahertz Metasurfaces Based on Bound States in the Continuum (Bic) and Quasi-Bic for Dynamic Near-Field Imaging (2021). Available at SSRN: https://ssrn.com/abstract=3943843 or http://dx.doi.org/10.2139/ssrn.3943843

Fuyu Li

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices ( email )

Chengdu
China

Yuanxun Li (Contact Author)

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices ( email )

Chengdu
China

Tingting Tang

Chengdu University of Information Technology ( email )

No.24 Block 1, Xuefu Road, Chengdu, China
Chengdu, Sichuan 610225
China

Yulong Liao

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices ( email )

Chengdu
China

Yongcheng Lu

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices ( email )

Chengdu
China

Rui Peng

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices ( email )

Chengdu
China

Qin Zhang

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices ( email )

Chengdu
China

Xinyan Liu

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices ( email )

Chengdu
China

Yang Luo

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices ( email )

Chengdu
China

Shengye Wang

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices ( email )

Chengdu
China

Qiye Wen

University of Electronic Science and Technology of China (UESTC) - State Key Laboratory of Electronic Thin Films and Integrated Devices ( email )

Chengdu
China

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