Effect of Wire-Arc Additive Manufacturing Thermal Cycles on Microstructural and Properties of Al-Zn-Mg-Cu Alloy

21 Pages Posted: 22 Mar 2022

See all articles by Min Xu

Min Xu

Beijing University of Technology

Shujun Chen

Beijing University of Technology

Tao Yuan

Beijing University of Technology

Xiaoqing Jiang

Beijing University of Technology

Hongda Zhang

Beijing University of Technology

Yafeng Bai

affiliation not provided to SSRN

Abstract

Al-Zn-Mg-Cu alloy has special significance for aerospace applications, and wire-arc additive manufacturing (WAAM) provides a way to produce large-scale metal structures. However, research on the effects of WAAM thermal cycles on the microstructure and mechanical properties of Al-Zn-Mg-Cu alloy is still lacking. This research focused on understanding the effects of thermal cycles on microstructure evolution and mechanical behavior of the as-deposited parts. Results indicated that the parts mainly contained microcracks (predominantly liquation cracks), interdendritic porosity, and interdendritic crystalline phase, which decreased the tensile properties. The grain morphology was dominated by the orientations reached ~65° to the deposition direction, which led to higher tensile properties in the longitudinal direction than in the transverse direction. In addition, the thermal cycles affected the softening behavior in the lower parts, and dominated the size and type of the hardening precipitates. The continuous high temperature during WAAM thermal cycles provided the strong driving force for dynamic precipitation, resulting in an over-aging forming η′ and coarse η phase in the lower part.

Keywords: Wire-arc additive manufacturing, Microstructure, Al-Zn-Mg-Cu alloy, Thermal cycle

Suggested Citation

Xu, Min and Chen, Shujun and Yuan, Tao and Jiang, Xiaoqing and Zhang, Hongda and Bai, Yafeng, Effect of Wire-Arc Additive Manufacturing Thermal Cycles on Microstructural and Properties of Al-Zn-Mg-Cu Alloy. Available at SSRN: https://ssrn.com/abstract=4027885 or http://dx.doi.org/10.2139/ssrn.4027885

Min Xu

Beijing University of Technology ( email )

100 Ping Le Yuan
Chaoyang District
Beijing, 100020
China

Shujun Chen

Beijing University of Technology ( email )

100 Ping Le Yuan
Chaoyang District
Beijing, 100020
China

Tao Yuan (Contact Author)

Beijing University of Technology ( email )

100 Ping Le Yuan
Chaoyang District
Beijing, 100020
China

Xiaoqing Jiang

Beijing University of Technology ( email )

100 Ping Le Yuan
Chaoyang District
Beijing, 100020
China

Hongda Zhang

Beijing University of Technology ( email )

100 Ping Le Yuan
Chaoyang District
Beijing, 100020
China

Yafeng Bai

affiliation not provided to SSRN ( email )

No Address Available

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