Gradient Nanostructured Tungsten and the Thermal Shock Response

16 Pages Posted: 6 Jun 2022

See all articles by Yan Jiang

Yan Jiang

Panzhihua University

P. Huang

Panzhihua University

J. Hou

Panzhihua University

Z. Xu

Panzhihua University

E.H. Wu

Panzhihua University

J. Li

Panzhihua University

Z.Q. Jiang

Panzhihua University

Abstract

In service environments, the surface of tungsten is damaged first. To enhance the surface toughness, strength, and hardness of tungsten, a lamellar gradient surface layer (up to about 50 μm) from nano to microscale was produced on as-rolled pure tungsten using a dry sliding method called surface mechanical attrition treatment. The dry-sliding temperature and time were established based on the evolution of grain size from room temperature to 750 °C and the coefficient of friction. During the refinement of surface grains with temperature, above the ductile-brittle transition temperature(DBTT) of tungsten, the grains rapidly changed their orientation and gradually changed into a fiber-based structure during deformation. 500°C is a suitable operating temperature, for dynamic recrystallization occurred at 750 °C. The COF decreased with friction time and stabilized at about 50 min, indicating near-saturation in surface refinement. Repetitive thermal loads of 10–30 MW/m 2 were exerted on the gradient layer surface, and corresponding response was analyzed. Heat load of 30 MW/m 2 is the threshold for grain fast growth of tungsten. The nano-gradient W sample undergoes relatively slow recrystallization and grain growth, in contrast to holes and protrusion structure as well as recrystallization in the as-rolled W sample.

Keywords: Dry sliding, Coefficient of friction, Gradient layer, tungsten

Suggested Citation

Jiang, Yan and Huang, P. and Hou, J. and Xu, Z. and Wu, E.H. and Li, J. and Jiang, Z.Q., Gradient Nanostructured Tungsten and the Thermal Shock Response. Available at SSRN: https://ssrn.com/abstract=4129093 or http://dx.doi.org/10.2139/ssrn.4129093

Yan Jiang (Contact Author)

Panzhihua University ( email )

Sichuan
China

P. Huang

Panzhihua University ( email )

Sichuan
China

J. Hou

Panzhihua University ( email )

Sichuan
China

Z. Xu

Panzhihua University ( email )

Sichuan
China

E.H. Wu

Panzhihua University ( email )

Sichuan
China

J. Li

Panzhihua University ( email )

Sichuan
China

Z.Q. Jiang

Panzhihua University ( email )

Sichuan
China

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