A Binary Resin System of Epoxy and Phenol-Formaldehyde for Improving the Thermal Behavior of Frp Composites

20 Pages Posted: 21 Oct 2022

See all articles by TianQiao Liu

TianQiao Liu

Beijing University of Technology

Ruibao Wang

Beijing University of Technology

Shilong Zhen

Beijing University of Technology

Peng Feng

Tsinghua University

Abstract

A binary resin system combing epoxy and phenol-formaldehyde is proposed for improving the thermal behavior of FRP composites. Five types of FRP plates with varying resin recipes were fabricated through compression molding process. Thermal-mechanical tests were conducted at various temperatures to evaluate the glass transition temperature and the degradation behavior of FRP plates. Owing to the polyaddition reaction between epoxy and phenol-formaldehyde, the proposed binary resin system is able to increase the glass transition temperature as well as to improve the mechanical properties of FRPs. Predictive models are recommended to assist the practical design of FRPs with binary resin system.

Keywords: FRP Composites, Binary Resin System, Thermal Behavior, Phenol-Formaldehyde, Epoxy

Suggested Citation

Liu, TianQiao and Wang, Ruibao and Zhen, Shilong and Feng, Peng, A Binary Resin System of Epoxy and Phenol-Formaldehyde for Improving the Thermal Behavior of Frp Composites. Available at SSRN: https://ssrn.com/abstract=4254738 or http://dx.doi.org/10.2139/ssrn.4254738

TianQiao Liu (Contact Author)

Beijing University of Technology ( email )

100 Ping Le Yuan
Chaoyang District
Beijing, 100020
China

Ruibao Wang

Beijing University of Technology ( email )

100 Ping Le Yuan
Chaoyang District
Beijing, 100020
China

Shilong Zhen

Beijing University of Technology ( email )

100 Ping Le Yuan
Chaoyang District
Beijing, 100020
China

Peng Feng

Tsinghua University ( email )

Beijing, 100084
China

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