A Wearable Dual-Mode Strain Sensing Yarn: Based on the Conductive Carbon Composites and Mechanoluminescent Layer with Core-Sheath Structures

15 Pages Posted: 28 Feb 2023

See all articles by ning sun

ning sun

Shanghai Institute of Technology

qinfei ke

Shanghai Institute of Technology

Yongzheng Fang

Shanghai Institute of Technology

Yaoqing Chu

Shanghai Institute of Technology

zhifu liu

Shanghai Institute of Technology

Abstract

The wearable strain sensor based on yarn or fiber has attracted wide attention. However, most of the previous research work is based on a single electrical signal or energy conversion sensor, which greatly reduces the application range of strain sensor. Therefore, multi-mode sensing under stress application conditions is particularly important, which also promotes the development of new materials. By combining resistive stress sensing with mechanical luminescence sensing, the two-mode strain sensing yarn is prepared and applied in wearable applications. The results show that the tensile strength of core-shell yarn can reach 180% and the surface brightness can reach the visual level. When the carbon concentration in the core fiber is 40%, the corresponding range is small and the resistance increases from 3 MΩ to 5MΩ. The doped luminescent powder has a strong luminescent peak at 578 nm and a small luminescent peak at 493 nm under the action of stress.

Keywords: Strain sensor, Mechanoluminescent, Conductive fiber, wearable, Dual mode sensing

Suggested Citation

sun, ning and ke, qinfei and Fang, Yongzheng and Chu, Yaoqing and liu, zhifu, A Wearable Dual-Mode Strain Sensing Yarn: Based on the Conductive Carbon Composites and Mechanoluminescent Layer with Core-Sheath Structures. Available at SSRN: https://ssrn.com/abstract=4373008 or http://dx.doi.org/10.2139/ssrn.4373008

Ning Sun

Shanghai Institute of Technology ( email )

China

Qinfei Ke

Shanghai Institute of Technology ( email )

China

Yongzheng Fang

Shanghai Institute of Technology ( email )

China

Yaoqing Chu

Shanghai Institute of Technology ( email )

China

Zhifu Liu (Contact Author)

Shanghai Institute of Technology ( email )

China

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