Interface Bonding Characteristics of 3d Printed Ultra-High Performance Concrete after Elevated Temperatures

46 Pages Posted: 10 Nov 2023

See all articles by Liang Dong

Liang Dong

Tianjin Chengjian University

Yekai Yang

Yanshan University

zhongxian liu

Tianjin Chengjian University

Chengqing Wu

University of Technology Sydney (UTS)

Abstract

This study explored the influence of elevated-temperature exposure and interlayer time intervals on the interface bonding behaviour of hybrid fibre 3D printed ultra-high performance concrete (3DP-UHPC). Mould-casting concrete (MC-UHPC) specimens of different casting time intervals were also used as references to analyse the differences in bonding performance. The bonding strength of both 3DP-UHPC and MC-UHPC after elevated-temperature exposure was measured, and a relationship model for the bonding strength of hybrid fibre 3DP-UHPC in elevated-temperature environments was proposed. Results revealed that local damage occurred during heating up to 800°C. The addition of 0.5% polypropylene fibres delayed bursting behaviour of 3DP-UHPC during heating and enhanced its resistance to elevated temperatures by providing a pathway for moisture loss. The bonding strength decreased with longer time intervals, as well as above 400°C, the melting and volatilization of polypropylene fibres negatively affected the bonding strength of 3DP-UHPC. This study's findings offer insights for the development and design of 3DP-UHPC structures in elevated-temperature environments.

Keywords: 3DP-UHPC, hybrid fibre, elevated-temperature, interface bonding performance, bonding strip

Suggested Citation

Dong, Liang and Yang, Yekai and liu, zhongxian and Wu, Chengqing, Interface Bonding Characteristics of 3d Printed Ultra-High Performance Concrete after Elevated Temperatures. Available at SSRN: https://ssrn.com/abstract=4628903 or http://dx.doi.org/10.2139/ssrn.4628903

Liang Dong

Tianjin Chengjian University ( email )

China

Yekai Yang

Yanshan University ( email )

School of Information Science and Engineering
Qinhuangdao
China

Zhongxian Liu

Tianjin Chengjian University ( email )

China

Chengqing Wu (Contact Author)

University of Technology Sydney (UTS) ( email )

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