The Fully Coupled Thermo-Mechanical Dual-Horizon Peridynamic Correspondence Damage Model for Homogeneous and Heterogeneous Materials

Abstract

To accurately address the thermally induced dynamic and steady-state crack propagation problems for homogeneous and heterogeneous materials involving crack branching, interfacial de-bonding and crack kinking, we propose the fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model (TM-DHPD). To this end, the integral coupled equations for TM-DHPD are firstly derived within the framework of thermodynamics. And then, the alternative dual-horizon peridynamic correspondence principle is used to derive the constitutive bond force state, heat flow state and their general linearizations. Moreover, the unified criterion for bond damage is proposed to characterize the internal bond damage in a single material and the interface bond damage in dissimilar materials. To ensure convergence and accuracy, the coupled equations are solved using the standard implicit method without the use of artificial damping. In both homogeneous and heterogeneous materials, some representative and challenging numerical cases are examined, such as dynamic crack branching in a centrally heated disk and multiple interface failure of thermal barrier coating. The numerical results are in good agreement with the available experimental results or the previous predictions, which shows the great potential of the proposed TM-DHPD in addressing the physics of numerous thermally induced fractures in the real-world engineering problems.

Keywords: Thermally induced fractures, Peridynamics, Crack branching, Interfacial de-bonding, Heterogeneous materials.