Enhanced Through-Plane Thermal Conductivity of Graphene Membrane by the Interlayer Microstructure Manipulation

Abstract

Graphene, having extremely low through-plane thermal conductivity (TPTC), limits its applicability in much circumstance. A novel strategy is proposed to enhance the TPTC of graphene membranes (GNMs) by improving the interlayer bonding through decoration with metal elements. The multiscale simulation results found that the decoration with interface elements (Al, Ti, and Ni) enhanced the interlayer bonding state so that the strong electron localization formed in the interlayer of Ti- or Al-decorated GN sheets. Besides, the Al-, Ni-, or Co-decorated GNMs preparation was carried out and induced higher TPTC (175–400 W/m•K) than that of pure GNM (~140 W/m•K), which sees as the realization of the simulation results. The interlayer decoration enhanced the TPTC of GNM is meaningful for the thermal management performance in both vertical and horizontal directions.

Keywords: B. Thermal conductivity, B. Interface, C. Analytical modelling, Graphene membrane, Interlayer decoration