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Phonon Relaxation Effect by Regeneration of Nano-Inclusions in Sige for Ultralow Thermal Conductivity and Enhanced Thermoelectric Performance

20 Pages Posted: 21 Feb 2024 Publication Status: Published

See all articles by Hongbo Chen

Hongbo Chen

Guangxi University

Zhongwei Zhang

Guangxi University

Jisheng Liang

Guangxi University

Lei Miao

Guangxi University

Qi Zhou

Guangxi University

Ying Peng

Toyota Technological Institute

Chengyan Liu

Guilin University of Electronic Technology

Junliang Chen

Guilin University of Electronic Technology

Huajun Lai

Guilin University of Electronic Technology

Abstract

SiGe alloys exhibit high thermoelectric performance in mid to high temperatures while intrinsic high thermal conductivities hinder its wide applications. Here, we report a new strategy on regeneration of ultrafine nano phases of CrSi2 and SiO2 with an average diameter of ~130 nm by chemical reaction of Si with highly oxidizing CrO3 in P type SiGe matrix. Based on the Debye-Callaway simulation, the nano-sized second phase leads to the reduction of phonon relaxation time, thereby reducing the lattice thermal conductivity to ultralow value of 2.15 W/mK at 873K. The boundaries between the second phases (CrSi2) and the matrix (SiGe) established potential barriers, which allowed carrier filtering and phonon scattering, thus pushing up the power factor. Eventually, the sample (CrO3)0.3-Si80Ge20B0.5 reaches a peak ZT of ~1.12 at 873 K, with an average ZT of ~0.62 from 323 K to 873 K, achieved 55.56% improvement compared with Si80Ge20B0.5. Our method provides a promising approach for improving the thermoelectric performance of SiGe.

Keywords: thermoelectric materials, p-type SiGe, phonon engineering, regeneration of nano-inclusions

Suggested Citation

Chen, Hongbo and Zhang, Zhongwei and Liang, Jisheng and Miao, Lei and Zhou, Qi and Peng, Ying and Liu, Chengyan and Chen, Junliang and Lai, Huajun, Phonon Relaxation Effect by Regeneration of Nano-Inclusions in Sige for Ultralow Thermal Conductivity and Enhanced Thermoelectric Performance. Available at SSRN: https://ssrn.com/abstract=4734397 or http://dx.doi.org/10.2139/ssrn.4734397

Hongbo Chen

Guangxi University ( email )

East Daxue Road #100
Nanning, 530004
China

Zhongwei Zhang

Guangxi University ( email )

East Daxue Road #100
Nanning, 530004
China

Jisheng Liang

Guangxi University ( email )

East Daxue Road #100
Nanning, 530004
China

Lei Miao (Contact Author)

Guangxi University ( email )

East Daxue Road #100
Nanning, 530004
China

Qi Zhou

Guangxi University ( email )

East Daxue Road #100
Nanning, 530004
China

Ying Peng

Toyota Technological Institute ( email )

Nagoya
Japan

Chengyan Liu

Guilin University of Electronic Technology ( email )

Guilin
China

Junliang Chen

Guilin University of Electronic Technology ( email )

Guilin
China

Huajun Lai

Guilin University of Electronic Technology ( email )

Guilin
China

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