Microstructure Evolution in Cu-2.13fe-0.026p (Wt%): The Contribution of Texture Intensity to Residual Stress Variation

Abstract

The leadframe is a crucial part that is frequently employed in electronic equipment, and the stability and dependability of the device are directly impacted by its performance. In this work, the microstructural evolution of Cu-2.13Fe-0.026P alloy and the relationship between the texture intensity and residual stress under different annealing time are investigated, and the corrosion behavior of the alloy in HCl and CuCl2 solution systems is summarized. It was found that regulating the texture intensity of the alloys could significantly influence the residual stresses. The residual stress is not monotonically decreasing with time, and the alloys have the lowest residual stress when annealed for 10 minutes. In addition, the experiments pointed out that the microstructure is essential for the etching performance of copper alloys. The role of low-Σcoincidence site lattice (ΣCSL) grain boundaries in the connectivity of the random high-angle grain boundaries (RHAGB) network leads to better etching performance of the 10-minute annealed alloys than the 30-minute alloys, providing new perspectives on optimizing the microstructure of thin strips of etched copper alloys.

Keywords: Copper alloy, microstructural evolution, texture intensity, Residual stress, corrosion behavior