Experimental Study on the Dynamic Integration of Pcm in Building Walls for Enhancing Thermal Performance in Summer Condition

24 Pages Posted: 9 Jul 2024

See all articles by Wendong LI

Wendong LI

University of Lorraine

Mourad Rahim

University of Lorraine

Dongxia Wu

Tianjin University of Commerce

Mohammed El Ganaoui

Indian Institute of Technology (IIT), Gandhinagar

Rachid Bennacer

Université Paris-Saclay Université Paris-Saclay, ENS Paris-Saclay, CNRS, LMPS,

Abstract

Passively integrating phase change material into the walls to enhance the thermal performance of the building has been a promising solution in recent years. As the PCM has a high latent heat capacity, it leads to damping the high variations of temperature and provides an obvious benefit in energy saving and indoor comfort. However, the traditional passive integration method of the PCM limited the utilization of the PCM. The thermal resistance between the PCM and the indoors restrains the thermal response of the PCM, and it between the PCM and the outdoors reduces the impact of outdoor heating or cooling on the PCM. In this study, a dynamic PCM integration in the building envelope method was proposed and experimentally investigated. A PCM layer and an air layer were combined to be integrated into the wall assembly, which allows the position of the PCM layer and the air layer could be changed to adjust the thermal resistance (air layer) between the PCM and indoors and outdoors.

Keywords: Phase change material, building envelope, dynamic integration, thermal performance.

Suggested Citation

LI, Wendong and Rahim, Mourad and Wu, Dongxia and El Ganaoui, Mohammed and Bennacer, Rachid, Experimental Study on the Dynamic Integration of Pcm in Building Walls for Enhancing Thermal Performance in Summer Condition. Available at SSRN: https://ssrn.com/abstract=4889729 or http://dx.doi.org/10.2139/ssrn.4889729

Wendong LI (Contact Author)

University of Lorraine ( email )

Mourad Rahim

University of Lorraine ( email )

Dongxia Wu

Tianjin University of Commerce ( email )

P.O. box 9007
Tianjin 300072
United States

Mohammed El Ganaoui

Indian Institute of Technology (IIT), Gandhinagar ( email )

Rachid Bennacer

Université Paris-Saclay Université Paris-Saclay, ENS Paris-Saclay, CNRS, LMPS, ( email )

Gif-sur-Yvette
France

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