Ultrasonic Vibration-Induced Amorphization in the Cu-Al Interface

6 Pages Posted: 11 Jul 2024

See all articles by X. M. Cheng

X. M. Cheng

Hohai University

Ke Yang

affiliation not provided to SSRN

Y.F. Wu

affiliation not provided to SSRN

Jian Wang

Jiangsu University of Technology

Jianhua Zhao

affiliation not provided to SSRN

Abstract

A ~40 nm thick nanocrystal-amorphous mixed zone was found at the Cu/Al interface induced by ultrasonic welding. It is believed that the formation of amorphous Cu/Al alloys is attributed to the local free energy increase and shear stresses during ultrasonic vibration. The lowering of the amorphization barrier is a prerequisite for ultrasonic vibration-induced interfacial amorphization, which is in intrinsic contrast to previously reported dislocation-mediated amorphization.

Keywords: Amorphous, structural, Ultrasonic welding, Copper, Aluminum

Suggested Citation

Cheng, X. M. and Yang, Ke and Wu, Y.F. and Wang, Jian and Zhao, Jianhua, Ultrasonic Vibration-Induced Amorphization in the Cu-Al Interface. Available at SSRN: https://ssrn.com/abstract=4891664 or http://dx.doi.org/10.2139/ssrn.4891664

X. M. Cheng

Hohai University ( email )

Ke Yang (Contact Author)

affiliation not provided to SSRN ( email )

No Address Available

Y.F. Wu

affiliation not provided to SSRN ( email )

No Address Available

Jian Wang

Jiangsu University of Technology ( email )

Jianhua Zhao

affiliation not provided to SSRN ( email )

No Address Available

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