Grinding Quality Evaluation and Removal Mechanism of Resin-Coated Sic and 2.5d-C-Sics Surface Strategies

Abstract

The paper proposes a strategy to enhance the processing quality of SiC and 2.5D-C-SiCs by coating epoxy resins on the material surface and edges, and then using resin-bonded diamond grinding tools for grinding. Epoxy resin acts as a protective layer that can absorb impacts during grinding, reduce damage, and thus improve the processing quality of the surface and edges. The experimental results show that resin coatings can effectively improve the surface quality of SiC and 2.5D-C-SiCs. By adjusting the RT and RE, processing parameters can be further optimized to achieve the best surface quality. This study provides new ideas and methods for enhancing the surface quality of SiC and 2.5D-C-SiCs materials, with important application prospects and practical significance.

Keywords: single-phase SiC, 2.5D-C-SiCs, Surface quality, Grinding