Multi-Field Coupling Modeling of Multilayer-Stacked Piezoelectric Semiconductor Structures Considering Geometrical and Physical Nonlinearities

Abstract

Multilayer-stacked piezoelectric semiconductor (MSPS) structures are promising building blocks for flexible electronic devices. Multi-field coupling mechanical analysis and modeling are fundamentally important for the development of novel devices. We present a two-dimensional (2-D) thermo-deformation-polarization-carrier (TDPC) coupling plate model for MSPS structures, considering both geometrical and physical nonlinearities. The model is based on the approximate expansion of displacement, electric potential, carrier concentration, and temperature change along the thickness direction. The derived plate model consists of two parts: the zeroth-order and the first-order equations, which describe the in-plane extensional and out-of-plane flexural deformations, respectively. The derived TDPC coupling plate model is validated against three-dimensional (3-D) finite element results. We investigate the multifield coupling mechanical responses of MSPS plates under single mechanical or thermal load, as well as combinations of mechanical and thermal loads. The numerical results could provide useful guidance for the design and manufacturing processes of the MSPS-based devices.

Keywords: MSPS plates, TDPC coupling, geometrical and physical nonlinearities, plate model