Influence of Diffusion Bonding Temperature on the Interfacial Evolution Behaviors of Gh4169 Joints Produced by Solid-State Diffusion Bonding Additive Manufacturing

The influence of bonding temperature on the interfacial evolution of GH4169 joints produced by solid-state diffusion bonding additive manufacturing (DB-AM) was studied. Joints bonded below 1020°C exhibit fine recrystallized grains due to dislocation-induced sub-grain rotation, resulting in continuous dynamic recrystallization (CDRX). At bonding temperatures above 1020°C, DB-AM joints show grain recombination and growth, interfacial migration, and interfacial micro-voids due to the low dislocation density weakening the effect of dislocation on interface diffusion. The difference in stored energy between grains on both sides of the bonding interface can cause partial grain boundary migration, potentially inducing discontinuous dynamic recrystallization (DDRX).

Keywords: Diffusion bonding temperature, GH4169 DB-AM joint, interfacial evolution behaviors, Dynamic recrystallization

Suggested Citation: Suggested Citation

Zhang, Mingchuan and Ren, Dechun and Xu, Qinsi and Mu, Yiqiang and Liu, Yi and Cai, Yusheng and Ji, H.B. and Lei, Jiafeng, Influence of Diffusion Bonding Temperature on the Interfacial Evolution Behaviors of Gh4169 Joints Produced by Solid-State Diffusion Bonding Additive Manufacturing. Available at SSRN: https://ssrn.com/abstract=4979229 or http://dx.doi.org/10.2139/ssrn.4979229