Study on Microstructure and Impact Abrasion Wear Resistance of In-Situ Ticp/Hcci Dual Scale Composites

32 Pages Posted: 3 Mar 2025

See all articles by Yunkun Zhao

Yunkun Zhao

affiliation not provided to SSRN

Mojin Zhou

affiliation not provided to SSRN

Zhijie Wang

affiliation not provided to SSRN

Jian Yang

affiliation not provided to SSRN

Yehua Jiang

Kunming University of Science and Technology

Yudong Sui

affiliation not provided to SSRN

Abstract

The in situ TiCp/HCCI composites with a dual scale was fabricated by cast infiltration. A moderator was introduced to control TiCp volume fraction and size. Analyze the moderator effects on composites phases by First principles calculations and the effects on the impact wear resistance. Ti and Mn in the moderator improved the deformation resistance of the phases in the matrix, while Fe and Mn enhanced the toughness of TiC. The higher the content of moderator in composites, the smaller the volume fraction and particle size of TiC. When the content of moderator is 20 wt.%, the volume fraction of TiC in the composites is 58.91%, the particle size is 3.15μm and its wear resistance is 2.03 times that of HCCI.

Keywords: In-situ, TiC, Wear mechanism, First-principle calculations

Suggested Citation

Zhao, Yunkun and Zhou, Mojin and Wang, Zhijie and Yang, Jian and Jiang, Yehua and Sui, Yudong, Study on Microstructure and Impact Abrasion Wear Resistance of In-Situ Ticp/Hcci Dual Scale Composites. Available at SSRN: https://ssrn.com/abstract=5163649 or http://dx.doi.org/10.2139/ssrn.5163649

Yunkun Zhao

affiliation not provided to SSRN ( email )

No Address Available

Mojin Zhou (Contact Author)

affiliation not provided to SSRN ( email )

No Address Available

Zhijie Wang

affiliation not provided to SSRN ( email )

No Address Available

Jian Yang

affiliation not provided to SSRN ( email )

No Address Available

Yehua Jiang

Kunming University of Science and Technology ( email )

Kunming Yunnan China
Kunming
China

Yudong Sui

affiliation not provided to SSRN ( email )

No Address Available

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