A Multi-Layer Model for Residual Stress Relaxation Aligned with Microstructure Evolution Under Thermal Exposure and Cyclic Loading

47 Pages Posted: 12 Mar 2025

See all articles by Dianyin Hu

Dianyin Hu

affiliation not provided to SSRN

Tao Wang

affiliation not provided to SSRN

Hongyang Huang

affiliation not provided to SSRN

Jianxing Mao

affiliation not provided to SSRN

Jier Wang

affiliation not provided to SSRN

Xin WANG

affiliation not provided to SSRN

Yang Gao

Nanjing University of Science and Technology

Liucheng Zhou

Air Force Engineering University - Science and Technology on Plasma Dynamics Laboratory

Rongqiao Wang

affiliation not provided to SSRN

Abstract

Residual stress relaxation phenomena under thermomechanical conditions, particularly thermal exposure and cyclic loading, constitute critical determinants of fatigue performance in surface-treated engineering components. This study systematically investigates the thermal and cyclic relaxation mechanisms in shot-peened Ni-based superalloy GH4720Li through integrated experimental characterization and computational modeling. Through systematic characterization via X-ray diffraction (XRD) and electron backscatter diffraction (EBSD), we establish quantitative correlations between residual stress relaxation kinetics and concurrent microstructure evolution, particularly dislocation annihilation and grain boundary restructuring. Building upon these observations, a novel multilayer constitutive framework is developed to decouple the synergistic effects of microstructural evolution on residual stress relaxation dynamics. The model demonstrates predictive accuracy within 6.3% for residual stress magnitudes and 3.3% for characteristic depth parameters when compared to stabilized thermal exposure data. Under cyclic loading conditions, corresponding errors remain constrained to 15.5% and 4.8%, respectively. Such precision validates the model's capability to isolate microstructure-driven relaxation mechanisms from purely mechanical contributions. This multi-physics framework provides an unprecedented quantitative tool for optimizing surface-engineered components operating in combined high-temperature and cyclic loading environments, effectively bridging the gap between microstructure-aware modeling and industrial fatigue life prediction.

Keywords: residual stress relaxation, microstructure evolution, thermal exposure, cyclic loading, analytical model

Suggested Citation

Hu, Dianyin and Wang, Tao and Huang, Hongyang and Mao, Jianxing and Wang, Jier and WANG, Xin and Gao, Yang and Zhou, Liucheng and Wang, Rongqiao, A Multi-Layer Model for Residual Stress Relaxation Aligned with Microstructure Evolution Under Thermal Exposure and Cyclic Loading. Available at SSRN: https://ssrn.com/abstract=5175707 or http://dx.doi.org/10.2139/ssrn.5175707

Dianyin Hu

affiliation not provided to SSRN ( email )

Tao Wang

affiliation not provided to SSRN ( email )

Hongyang Huang

affiliation not provided to SSRN ( email )

Jianxing Mao (Contact Author)

affiliation not provided to SSRN ( email )

Jier Wang

affiliation not provided to SSRN ( email )

Xin WANG

affiliation not provided to SSRN ( email )

Yang Gao

Nanjing University of Science and Technology ( email )

No.219, Ningliu Road
Nanjing, 210094
China

Liucheng Zhou

Air Force Engineering University - Science and Technology on Plasma Dynamics Laboratory ( email )

Xi’an, 710038
China

Rongqiao Wang

affiliation not provided to SSRN ( email )

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