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Yanqiang Li

Dalian University of Technology

Huiying Rd

DaLian, LiaoNing, 116024

China

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Scholarly Papers (1)

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Study of the Interface Microstructure of Silver-plated Copper-clad Aluminum Wire

Number of pages: 8 Posted: 06 Apr 2026
Inner Mongolia University of Science and Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Dalian University of Technology, Northeastern University (USA), Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, affiliation not provided to SSRN and Key Laboratory of solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology
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Abstract:

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Silver-plated copper-clad aluminum wire, Annealing, IMCs, Interfaces