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Yu Wang

Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory

Dongguan, 523808

China

  • Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory

SCHOLARLY PAPERS

7

DOWNLOADS

156

TOTAL CITATIONS

3

Scholarly Papers (7)

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1.

Influence of Annealing Texture Evolution on the Mechanical and Electrical Performance of Rolled Copper Foils

Number of pages: 40 Posted: 19 Aug 2024
Jijun Wang, Zhongyi Zhao, Yilin Jia, ying fu, Kun Zhou, Wanting Sun, Yu Wang and xiangqing kong
Liaoning University of Technology, Liaoning University of Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Liaoning University, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory and Liaoning University of Technology
Downloads 49 (1,074,648)
Citation 3

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Rolled Cu foil, Microstructure evolution, Strong cube texture, Electrical property, Mechanism property, Bend fatigue performance

2.

Processing-induced microstructural evolution and structure–property relationships in three-dimensional graphene network Cu composites

Downloads 37 (1,236,159)

Processing-induced microstructural evolution and structure–property relationships in three-dimensional graphene network Cu composites

Number of pages: 39 Posted: 06 Jan 2026
Jijun Wang, Ruixiang Zhang, Kun Zhou, Wanting Sun, Chuanhui Cheng, Ran Zhuo, Yu Wang, Muhong Wu and ying fu
Liaoning University of Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Liaoning University, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, China Southern Power Grid Co., Ltd. (CSG), China Electric Power Research Institute, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory and Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory
Downloads 27 (1,415,710)

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Cu/Gr composites, 3D networked Gr, Microstructure evolution, Electrical property, Mechanism property

Processing-induced microstructural evolution and structure–property relationships in three-dimensional graphene network Cu composites

Number of pages: 29 Posted: 25 Feb 2026
Jijun Wang, Ruixiang Zhang, Kun Zhou, Wanting Sun, Chuanhui Cheng, Ran Zhuo, Yu Wang, Muhong Wu and Ying Fu
Liaoning University of Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Liaoning University, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, China Southern Power Grid Co., Ltd. (CSG), China Electric Power Research Institute, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory and Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory
Downloads 10 (1,606,395)

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Cu/Gr composites, 3D networked Gr, microstructure evolution, Electrical property, Mechanism property

3.

Design Strategy to Simultaneously Enhance Electrical Conductivity and Strength: Cold-Drawn Copper-Based Composite Wire with In-Situ Graphene

Number of pages: 39 Posted: 27 Feb 2024
Kun Zhou, Wanting Sun, Qianyi Liu, Yu Wang, xiangqing kong, Ruixiang Zhang, ying fu, Muhong Wu and Kaihui Liu
Liaoning University, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Liaoning University of Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory and Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory
Downloads 20 (1,448,301)

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Copper matrix composite, Chemical vapor deposition, Microstructure evolution, Electrical conductivity, Strengthening mechanism

4.

Microstructural and property evolution of layered composites from single-crystal Cu/Gr foils during hot pressing and rolling

Number of pages: 31 Posted: 07 Oct 2025
Jijun Wang, Xiaolei Hu, Kun Zhou, Wanting Sun, Chuanhui Cheng, Ran Zhuo, Yu Wang, Muhong Wu and ying fu
Liaoning University of Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Liaoning University, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, China Southern Power Grid Co., Ltd. (CSG), China Electric Power Research Institute, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory and Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory
Downloads 19 (1,459,862)

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Cu/Gr composites, microstructure evolution, Electrical property, Mechanism property

5.

Ultrasonic Welding Graphene/Copper Laminated Composites Evolution of Microstructure and Properties

Number of pages: 15 Posted: 16 Aug 2025
Kun Zhou, Ruixiang Zhang, Jijun Wang, Zhaoxiang Li, Yu Wang, Wanting Sun, Min Ding, Chuanhui Cheng, Ran Zhuo, Muhong Wu and ying fu
Liaoning University, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Liaoning University of Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, China Southern Power Grid Co., Ltd. (CSG), China Electric Power Research Institute, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory and Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory
Downloads 17 (1,481,165)

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Copper/graphene composite, Ultrasonic welding, Interface, Electrical conductivity

6.

Integrated Cvd and Ultrasonic Welding for Fabricating High-Conductivity Copper/Graphene Laminated Composites

Number of pages: 15 Posted: 18 Jul 2025
Kun Zhou, Ruixiang Zhang, Jijun Wang, Zhaoxiang Li, Yu Wang, Wanting Sun, Min Ding, Chuanhui Cheng, Ran Zhuo, ying fu and Muhong Wu
Liaoning University, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Liaoning University of Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, China Southern Power Grid Co., Ltd. (CSG), China Electric Power Research Institute, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory and Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory
Downloads 9 (1,548,648)

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Copper/graphene composite, Ultrasonic welding, Interface, Electrical conductivity

7.

Study of the Interface Microstructure of Silver-plated Copper-clad Aluminum Wire

Number of pages: 8 Posted: 06 Apr 2026
Jiahui Zhang, Yu Wang, Kai Zhao, Shuai Pan, Yanqiang Li, Huijun Kang, E.Y. Guo, Jingwei Xian, Zongning Chen, Ying Fu, Changlong Yang and T.M. Wang
Inner Mongolia University of Science and Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, Dalian University of Technology, Northeastern University (USA), Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory, affiliation not provided to SSRN and Key Laboratory of solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology
Downloads 5 (1,571,455)

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Silver-plated copper-clad aluminum wire, Annealing, IMCs, Interfaces