Dongguan, 523808
China
Chinese Academy of Sciences (CAS) - Songshan Lake Materials Laboratory
Cu/Gr composites, 3D networked Gr, Microstructure evolution, Electrical property, Mechanism property
Cu/Gr composites, 3D networked Gr, microstructure evolution, Electrical property, Mechanism property
Copper matrix composite, Chemical vapor deposition, Microstructure evolution, Electrical conductivity, Strengthening mechanism
Copper/graphene composite, Ultrasonic welding, Interface, Electrical conductivity