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Letong Zhang

Beijing University of Technology

100 Ping Le Yuan

Chaoyang District

Beijing, 100020

China

  • Beijing University of Technology

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A variational-damage-based thermo-mechanical phase-field model for fracture analysis of electronic packaging structures

Number of pages: 41 Posted: 16 May 2026
Yanpeng Gong, Letong Zhang, Ya Duan, Tong An, Xiaoying Zhuang and Timon Rabczuk
Beijing University of Technology, Beijing University of Technology, Institute of Structural Mechanics, Bauhaus-University Weimar, Beijing University of Technology, Leibniz University Hannover and Bauhaus University - Institute of Structural Mechanics
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Abstract:

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Transformed phase-field cohesive zone model, Variational damage model, Thermo-mechanical coupling, Electronic packaging