default author photo

Yanpeng Gong

Beijing University of Technology

100 Ping Le Yuan

Chaoyang District

Beijing, 100020

China

  • Beijing University of Technology

SCHOLARLY PAPERS

5

DOWNLOADS

217

TOTAL CITATIONS

0

Scholarly Papers (5)

Actions:
Email selected abstracts
1.

A Phase-Field Study on Thermo-Mechanical Coupled Damage Evolution and Failure Mechanisms of Sintered Silver Interconnections

Downloads 75 (852,604)

A Phase-Field Study on Thermo-Mechanical Coupled Damage Evolution and Failure Mechanisms of Sintered Silver Interconnections

Number of pages: 27 Posted: 03 Dec 2024
Yanpeng Gong, Yuguo Kou, Qiang Yue, Xiaoying Zhuang, Navid Valizadeh, Fei Qin, Qiao Wang and Timon Rabczuk
Beijing University of Technology, Beijing University of Technology, Wuhan University, Leibniz University Hannover, Leibniz University Hannover, Beijing University of Technology, Wuhan University and Bauhaus University - Institute of Structural Mechanics
Downloads 45 (1,157,169)

Abstract:

Loading...

Sintered silver, Phase-field modeling, Thermomechanical coupling problems, Damage evolution, Failure mechanism

A Phase-Field Study on Thermo-Mechanical Coupled Damage Evolution and Failure Mechanisms of Sintered Silver Interconnections

Number of pages: 27 Posted: 09 Dec 2024
Yanpeng Gong, Yuguo Kou, Qiang Yue, Xiaoying Zhuang, Navid Valizadeh, Fei Qin, Qiao Wang and Timon Rabczuk
Beijing University of Technology, Beijing University of Technology, Wuhan University, Leibniz University Hannover, Leibniz University Hannover, Beijing University of Technology, Wuhan University and Bauhaus University - Institute of Structural Mechanics
Downloads 30 (1,371,100)

Abstract:

Loading...

sintered silver, phase-field modeling, Thermomechanical coupling problems, damage evolution, Failure mechanism

2.

A Coupled Finite Element-Boundary Element Method for Transient Elastic Dynamic Analysis of Electronic Packaging Structures

Number of pages: 22 Posted: 13 Sep 2024
Yanpeng Gong, Yida He, Han Hu, Xiaoying Zhuang, Fei Qin, Hao Xu and Timon Rabczuk
Beijing University of Technology, Beijing University of Technology, Leibniz University Hannover, Leibniz University Hannover, Beijing University of Technology, Beijing University of Technology and Bauhaus University - Institute of Structural Mechanics
Downloads 67 (899,324)

Abstract:

Loading...

FE-BE coupling method, Transient elastodynamics problem, electronic packaging, Abaqus implementation

3.

The Application of Thermomechanically Coupled Phase-Field Models in Electronic Packaging Interconnect Structures

Number of pages: 36 Posted: 03 Jul 2024
Yanpeng Gong and Qiang Yue
Beijing University of Technology and Wuhan University
Downloads 30 (1,345,526)

Abstract:

Loading...

Electronic packaging interconnect structures, Phase-field model, Thermomechanical coupling problems, Crack initiation and propagation

4.

A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures

Number of pages: 48 Posted: 28 Oct 2025
Yanpeng Gong, Sishuai Li, Fei Qin, Yue Mei, Xiaoying Zhuang and Timon Rabczuk
Beijing University of Technology, Beijing University of Technology, Beijing University of Technology, Dalian University of Technology, Leibniz University Hannover and Bauhaus University - Institute of Structural Mechanics
Downloads 27 (1,385,945)

Abstract:

Loading...

Virtual element method, FE-VE coupling, Thermomechanical analysis, Electronic packaging, Geometric multi-scale structures

5.

A variational-damage-based thermo-mechanical phase-field model for fracture analysis of electronic packaging structures

Number of pages: 41 Posted: 16 May 2026
Yanpeng Gong, Letong Zhang, Ya Duan, Tong An, Xiaoying Zhuang and Timon Rabczuk
Beijing University of Technology, Beijing University of Technology, Institute of Structural Mechanics, Bauhaus-University Weimar, Beijing University of Technology, Leibniz University Hannover and Bauhaus University - Institute of Structural Mechanics
Downloads 18 (1,534,404)

Abstract:

Loading...

Transformed phase-field cohesive zone model, Variational damage model, Thermo-mechanical coupling, Electronic packaging