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Sishuai Li

Beijing University of Technology

100 Ping Le Yuan

Chaoyang District

Beijing, 100020

China

  • Beijing University of Technology

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A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures

Number of pages: 48 Posted: 28 Oct 2025
Yanpeng Gong, Sishuai Li, Fei Qin, Yue Mei, Xiaoying Zhuang and Timon Rabczuk
Beijing University of Technology, Beijing University of Technology, Beijing University of Technology, Dalian University of Technology, Leibniz University Hannover and Bauhaus University - Institute of Structural Mechanics
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Abstract:

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Virtual element method, FE-VE coupling, Thermomechanical analysis, Electronic packaging, Geometric multi-scale structures