Yida He

Beijing University of Technology

100 Ping Le Yuan

Chaoyang District

Beijing, 100020

China

  • Beijing University of Technology

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A Coupled Finite Element-Boundary Element Method for Transient Elastic Dynamic Analysis of Electronic Packaging Structures

Number of pages: 22 Posted: 13 Sep 2024
Yanpeng Gong, Yida He, Han Hu, Xiaoying Zhuang, Fei Qin, Hao Xu and Timon Rabczuk
Beijing University of Technology, Beijing University of Technology, Leibniz University Hannover, Leibniz University Hannover, Beijing University of Technology, Beijing University of Technology and Bauhaus University - Institute of Structural Mechanics
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Abstract:

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FE-BE coupling method, Transient elastodynamics problem, electronic packaging, Abaqus implementation