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Haifeng Li

South China University of Technology

Wushan

Guangzhou, AR 510640

China

  • South China University of Technology

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Microstructure evolution and strength–conductivity synergy in Cu – 2Ag alloy wires induced by high-speed large deformation cold drawing

Number of pages: 24 Posted: 03 Jun 2026
Junchao Zhang, J. Cao, Liuyong He, Xiaoning Xu, Huiyi Tang, Baoan Wu, Wenjing Zhang, Haifeng Li and Xian Dong
Henan Polytechnic University, Henan Polytechnic University, Henan Polytechnic University, Henan Polytechnic University, Chongqing Materials Research Institute Co Ltd, Chongqing Materials Research Institute Co Ltd, affiliation not provided to SSRN, South China University of Technology and affiliation not provided to SSRN
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Cu alloy, Cold drawing, Strength -conductivity synergy, Nano-twins, Microstrip structure