affiliation not provided to SSRN
Palladium layer thicknesses、FAB formation characteristics、Bonding parameter、Bond morphology
Palladium layer thicknesses, FAB formation characteristics, Bonding parameter, Bond morphology
Dynamic DC interference, Reinforcement, Corrosion
Cu alloy, Cold drawing, Strength -conductivity synergy, Nano-twins, Microstrip structure
Rolling processing, Strengthening behaviour, Microstructure, Organizational evolution, Fracture mechanism