Bending creep, Creep substructure, High throughput characterization, Steady-state creep microstructure
Electromagnetic stress, Crack closure and materials healing, Life extension, Solid-state bonding, Thermal stress
Creep, Dislocation substructures, Length scale effects, Load-shedding, Surface affected region
Bending creep, Digital image correlation, Additive manufacturing, High throughput testing
Bending creep, Stress evolution, Transient creep, Ti-6Al
Length-scale effects, Power-law creep, Surface proximity effects, Strain gradient
Bending test, Plastic deformation, strain rate sensitivity, High throughput testing
A205, additive manufacturing, DIC-augmented-bending creep, High throughput creep testing, Structure-property relationship for creep
Creep-fatigue interaction, Damage evolution, Life prediction, Ni-based superalloy, IN740H
Bending creep, Composite cantilever samples, Digital image correlation, High-throughput creep testing, Residual life assessment.
Diffusion, Oxidation, Microstructure, bond coat, Superalloy
Threshold stress, γ′-lean Ni-based superalloys, Dislocation climb creep, Precipitate-dislocation interaction, Solute segregation.
Electromagnetic loading, fracture mechanics, Fractography, Incremental crack growth, Thin metallic foils
Crack closure force, digital image correlation, Fatigue crack growth, Overload during fatigue, Residual strain field