default author photo

Aristotle T. Ubando

De la Salle University

SCHOLARLY PAPERS

6

DOWNLOADS

752

TOTAL CITATIONS

0

Scholarly Papers (6)

Actions:
Email selected abstracts
1.

A Comprehensive Review of Thermogravimetric Analysis (Tga) in Lignocellulosic and Algal Biomass Gasification

Number of pages: 65 Posted: 21 Mar 2022
Charles B. Felix, Wei-Hsin Chen, Aristotle T. Ubando, Young-Kwon Park, Kun-Yi Andrew Lin, Thanh-Binh Nguyen and Cheng-Di Dong
National Cheng Kung University, National Cheng Kung University, De la Salle University, University of Seoul, National Chung Hsing University, National Kaohsiung University of Science and Technology and National Kaohsiung University of Science and Technology - Department of Marine Environmental Engineering
Downloads 430 (168,427)

Abstract:

Loading...

Thermogravimetric analysis (TGA), gasification, Kinetics, thermochemical conversion, biomass and bioenergy

2.

Flip-Chip Package Solder-Underfill Reliability Using Finite Element Analysis

Number of pages: 30 Posted: 07 Sep 2024
Niño Rigo Emil G. Lim, Aristotle T. Ubando and Jeremias A. Gonzaga
De la Salle University, De la Salle University and De la Salle University
Downloads 92 (730,864)

Abstract:

Loading...

flip-chip package, warpage, underfill, thermo-mechanical, finite element analysis, design of experiment

3.

Dewatering of Nannochloropsis Sp Via Forward Osmosis: A Molecular Dynamics Study

Number of pages: 23 Posted: 23 May 2020
Robby B. Manrique, Aristotle T. Ubando, Melanie Y. David, Nelson B. Arboleda, Al Rey Villagracia, Jo-Shu Chang, Wei-Hsin Chen and Alvin B. Culaba
De La Salle University, De la Salle University, De la Salle University, affiliation not provided to SSRN, Department of Physics, De La Salle University, National Cheng Kung University, National Cheng Kung University and De La Salle University
Downloads 69 (883,195)

Abstract:

Loading...

Microalgae, dewatering, molecular dynamics, lipid membranes, forward osmosis

4.

Interfacial Delamination on Fan-Out Wafer-Level Package Using Finite Element Analysis

Number of pages: 32 Posted: 08 Oct 2024
Ariel P. Conversion, Aristotle T. Ubando and Jeremias A. Gonzaga
De La Salle University, De la Salle University and De la Salle University
Downloads 60 (961,006)

Abstract:

Loading...

Interfacial delamination, fan-out wafer-level package, finite element analysis, virtual crack closure technique, energy release rate

5.

Sustainable Cement and Clay Support in Ni-Cu/Al2o3 Catalysts for Enhancing Hydrogen Production from Methanol Steam Reforming

Number of pages: 34 Posted: 05 Sep 2022
Wei-Hsin Chen, Chun-Yin Cheng, Yi-Kai Chih, Reiyu Chein, Aristotle T. Ubando, Meisam Tabatabaei, Su Shiung Lam and Hong-Ping Lin
National Cheng Kung University - Department of Aeronautics and Astronautics, National Cheng Kung University, National Cheng Kung University, National Chung Hsing University, De la Salle University, affiliation not provided to SSRN, Nanjing Forestry University - Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources and National Cheng Kung University
Downloads 54 (1,031,043)

Abstract:

Loading...

Methanol steaming reforming (MSR), hydrogen production, Ni-Cu/Al2O3, catalyst sustainable cement-clay composite, CO2 absorption, water gas shift reaction (WGSR)

6.

Crack Propagation in an Energy Storage Flywheel Rotor Using Finite Element Method

Number of pages: 47 Posted: 08 Oct 2024
Ailene Nuñez, Aristotle T. Ubando, Jeremias A. Gonzaga, Roy Navea, Gil Nonato C. Santos and Wei-Hsin Chen
De la Salle University, De la Salle University, De la Salle University, De la Salle University, De la Salle University - Physics Department and National Cheng Kung University
Downloads 47 (1,097,529)

Abstract:

Loading...

crack propagation, Fatigue, Flywheel, Energy Storage Systems, Finite Element Method