Ariel P. Conversion

De La Salle University

2401 Taft Avenue

Manila, 1004

Philippines

SCHOLARLY PAPERS

1

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0

Scholarly Papers (1)

1.

Interfacial Delamination on Fan-Out Wafer-Level Package Using Finite Element Analysis

Number of pages: 32 Posted: 08 Oct 2024
Ariel P. Conversion, Aristotle T. Ubando and Jeremias A. Gonzaga
De La Salle University, De la Salle University and De la Salle University
Downloads 47 (878,866)

Abstract:

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Interfacial delamination, fan-out wafer-level package, finite element analysis, virtual crack closure technique, energy release rate