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High-Temperature Nanoindentation Characterization of Sintered Nano-Copper Particles Used in High Power Electronics Packaging

Number of pages: 16 Posted: 27 Sep 2021

Jiajie Fan, Dawei Jiang, Hao Zhang, Dong Hu, Xu Liu, Xuejun Fan and Guoqi Zhang

Fudan University, Hohai University - School of Mechanical and Electrical Engineering, Nanyang Technological University (NTU) - School of Materials Science and Engineering, Delft University of Technology, Delft University of Technology, Lamar University and Delft University of Technology

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Dong Hu

Delft University of Technology

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High-Temperature Nanoindentation Characterization of Sintered Nano-Copper Particles Used in High Power Electronics Packaging

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