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Seung M. You

University of Texas at Dallas

2601 North Floyd Road

Richardson, TX 75083

United States

  • University of Texas at Dallas

SCHOLARLY PAPERS

3

DOWNLOADS

278

TOTAL CITATIONS

4

Scholarly Papers (3)

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1.

­Effects of Surface Wettability on Condensation with Impermeable and Microporous Surfaces

Downloads 103 (674,591)

­Effects of Surface Wettability on Condensation with Impermeable and Microporous Surfaces

Number of pages: 32 Posted: 19 May 2022
Hootan Rahimi, Xiaomeng Wang, Dani Fadda, Dong Hwan Shin, Seung M. You and Jungho Lee
University of Texas at Dallas, University of Texas at Dallas, University of Texas at Dallas, affiliation not provided to SSRN, University of Texas at Dallas and Ajou University
Downloads 53 (1,049,673)

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Condensation, Wettability, Microporous coating, Hydrophilic, Hydrophobic

­Effects of Surface Wettability on Condensation with Impermeable and Microporous Surfaces

Number of pages: 28 Posted: 16 Feb 2022
Jungho Lee, Hootan Rahimi, Xiaomeng Wang, Dani Fadda, Dong Hwan Shin and Seung M. You
Ajou University, University of Texas at Dallas, University of Texas at Dallas, University of Texas at Dallas, affiliation not provided to SSRN and University of Texas at Dallas
Downloads 50 (1,083,731)

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Condensation, Wettability, Microporous coating, Teflon coating

2.

Effect of Wettability on Pool Boiling Heat Transfer with Copper Microporous Coated Surface

Number of pages: 29 Posted: 11 May 2022
Xiaomeng Wang, Dani Fadda, Juan Godinez, Jungho Lee and Seung M. You
University of Texas at Dallas, University of Texas at Dallas, University of Texas at Dallas, Ajou University and University of Texas at Dallas
Downloads 96 (715,072)
Citation 2

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Wettability, Microporous Coating, Nucleate boiling, Critical Heat Flux

3.

New Thermal Packaging with a Boiling-Driven Heat Spreader for Thermal Management of the Power Electronics

Number of pages: 40 Posted: 16 Jun 2022
Hyunmuk Lim, Seung M. You and Jungho Lee
Ajou University, University of Texas at Dallas and Ajou University
Downloads 79 (809,932)
Citation 2

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electronics cooling, Power electronics, Thermal packaging, Boiling-driven heat spreader, Thermal management