Hyunmuk Lim

Ajou University

Woncheon-dong, Yeongtong-gu

Suwon-si, Gyeonggi-do

Korea, Republic of (South Korea)

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New Thermal Packaging with a Boiling-Driven Heat Spreader for Thermal Management of the Power Electronics

Number of pages: 40 Posted: 16 Jun 2022

Hyunmuk Lim, Seung M. You and Jungho Lee

Ajou University, University of Texas at Dallas and Ajou University

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