Sintered copper joints, Metallization, Interfacial diffusion, Molecular dynamics simulation, SiC power devices, Shear strength
Solidification structure, SnBi solder, Self-propagating reaction, high-speed heat source
U75V rail, Electroslag welding joint, Temperature field evolution, Microstructure, Mechanical property
U75V rail, Ti content, Electroslag welding, pearlite, Mechanical properties