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Xuemin Li

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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56

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Scholarly Papers (2)

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1.

Interfacial metallization effects on the microstructure and mechanical behavior of pressure-sintered copper joints for SiC power devices

Number of pages: 66 Posted: 28 Nov 2025
xinghe luan, Hengrui Li, Liguo Ding, Xuemin Li, Hongjie Zhang, Kewei Li, Longzao Zhou and Fengshun Wu
Huazhong University of Science and Technology, Huazhong University of Science and Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Huazhong University of Science and Technology and Huazhong University of Science and Technology
Downloads 31 (1,304,549)

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Sintered copper joints, Metallization, Interfacial diffusion, Molecular dynamics simulation, SiC power devices, Shear strength

2.

Atomistic simulation and experimental correlation analysis of metallization-dependent interfacial diffusion and shear failure in pressure-sintered Cu joints for SiC devices

Number of pages: 64 Posted: 14 Dec 2025
xinghe luan, Hengrui Li, Liguo Ding, Xuemin Li, Hongjie Zhang, Kewei Li, Longzao Zhou and Fengshun Wu
Huazhong University of Science and Technology, Huazhong University of Science and Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Huazhong University of Science and Technology and Huazhong University of Science and Technology
Downloads 25 (1,385,945)

Abstract:

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Sintered copper joints, Metallization, Interfacial diffusion, Molecular dynamics simulation, SiC power devices, Shear strength