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Kurt Matoy

Infineon Technologies Austria AG

Austria

  • Infineon Technologies Austria AG

SCHOLARLY PAPERS

2

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102

TOTAL CITATIONS

0

Scholarly Papers (2)

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1.

Ni-Nanoparticle Decorated Columnar Microstructure for an Electroless NiP Thin-Film: Micropillar Compression Response

Downloads 75 (844,901)

Ni-Nanoparticle Decorated Columnar Microstructure for an Electroless NiP Thin-Film: Micropillar Compression Response

Number of pages: 8 Posted: 17 Feb 2022
Chaowei Du, James P. Best, Siyuan Zhang, Kurt Matoy, Michael Reisinger, Johannes Zechner, Werner Robl, Robert Hartl, Martin Kotzbauer, Christoph Kirchlechner and Gerhard Dehm
Max Planck Institute for Iron Research, Max Planck Institute for Sustainable Materials, Max Planck Institute for Sustainable Materials, Infineon Technologies Austria AG, KAI Kompetenzzentrum Automobil- u. Industrieelektronik, Infineon Technologies Austria AG, Infineon Technologies Regensburg, Infineon Technologies Regensburg, Infineon Technologies Regensburg, Karlsruhe Institute of Technology - Institute for Applied Materials (IAM) and Max Planck Institute for Sustainable Materials
Downloads 46 (1,144,483)

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Electroless NiP plating, Micropillar compression, Amorphous alloys, Thin films, Columnar microstructure

Ni-Nanoparticle Decorated Columnar Microstructure for an Electroless NiP Thin-Film: Micropillar Compression Response

Number of pages: 8 Posted: 17 Feb 2022
Chaowei Du, James P. Best, Siyuan Zhang, Kurt Matoy, Michael Reisinger, Johannes Zechner, Werner Robl, Robert Hartl, Martin Kotzbauer, Christoph Kirchlechner and Gerhard Dehm
Max Planck Institute for Iron Research, Max Planck Institute for Sustainable Materials, Max Planck Institute for Sustainable Materials, Infineon Technologies Austria AG, KAI Kompetenzzentrum Automobil- u. Industrieelektronik, Infineon Technologies Austria AG, Infineon Technologies Regensburg, Infineon Technologies Regensburg, Infineon Technologies Regensburg, Karlsruhe Institute of Technology - Institute for Applied Materials (IAM) and Max Planck Institute for Sustainable Materials
Downloads 29 (1,371,100)

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Electroless NiP plating, Micropillar compression, Amorphous alloys, Thin films, Columnar microstructure

2.

Backside Metallization Affects Residual Stress and Bending Strength of the Recast Layer in Laser-Diced Si

Number of pages: 25 Posted: 16 Mar 2024
Tobias Ziegelwanger, Michael Reisinger, Kurt Matoy, Aicha Asma Medjahed, Jakub Zalesak, Manuel Gruber, Michael Meindlhumer and Jozef Keckes
Montanuniversität Leoben, affiliation not provided to SSRN, Infineon Technologies Austria AG, European Synchrotron Radiation Facility (ESRF), Austrian Academy of Sciences - Erich Schmid Institute of Materials Science, Montanuniversität Leoben, Montanuniversität Leoben and Montanuniversität Leoben - Chair of Materials Physics
Downloads 27 (1,359,097)

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Ultra-thin Si Dies, Nanosecond Laser Dicing, X-Ray nanodiffraction, Local Residual Stresses, Die Bending Strength