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Martin Kotzbauer

Infineon Technologies Regensburg

Regensburg

Germany

  • Infineon Technologies Regensburg

SCHOLARLY PAPERS

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Scholarly Papers (1)

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Ni-Nanoparticle Decorated Columnar Microstructure for an Electroless NiP Thin-Film: Micropillar Compression Response

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Ni-Nanoparticle Decorated Columnar Microstructure for an Electroless NiP Thin-Film: Micropillar Compression Response

Number of pages: 8 Posted: 17 Feb 2022
Chaowei Du, James P. Best, Siyuan Zhang, Kurt Matoy, Michael Reisinger, Johannes Zechner, Werner Robl, Robert Hartl, Martin Kotzbauer, Christoph Kirchlechner and Gerhard Dehm
Max Planck Institute for Iron Research, Max Planck Institute for Sustainable Materials, Max Planck Institute for Sustainable Materials, Infineon Technologies Austria AG, KAI Kompetenzzentrum Automobil- u. Industrieelektronik, Infineon Technologies Austria AG, Infineon Technologies Regensburg, Infineon Technologies Regensburg, Infineon Technologies Regensburg, Karlsruhe Institute of Technology - Institute for Applied Materials (IAM) and Max Planck Institute for Sustainable Materials
Downloads 46 (1,144,483)

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Electroless NiP plating, Micropillar compression, Amorphous alloys, Thin films, Columnar microstructure

Ni-Nanoparticle Decorated Columnar Microstructure for an Electroless NiP Thin-Film: Micropillar Compression Response

Number of pages: 8 Posted: 17 Feb 2022
Chaowei Du, James P. Best, Siyuan Zhang, Kurt Matoy, Michael Reisinger, Johannes Zechner, Werner Robl, Robert Hartl, Martin Kotzbauer, Christoph Kirchlechner and Gerhard Dehm
Max Planck Institute for Iron Research, Max Planck Institute for Sustainable Materials, Max Planck Institute for Sustainable Materials, Infineon Technologies Austria AG, KAI Kompetenzzentrum Automobil- u. Industrieelektronik, Infineon Technologies Austria AG, Infineon Technologies Regensburg, Infineon Technologies Regensburg, Infineon Technologies Regensburg, Karlsruhe Institute of Technology - Institute for Applied Materials (IAM) and Max Planck Institute for Sustainable Materials
Downloads 29 (1,371,100)

Abstract:

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Electroless NiP plating, Micropillar compression, Amorphous alloys, Thin films, Columnar microstructure