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Zheng Ye

University of Science and Technology Beijing

30 Xueyuan Road, Haidian District

beijing, 100083

China

  • University of Science and Technology Beijing

SCHOLARLY PAPERS

11

DOWNLOADS

374

TOTAL CITATIONS

5

Scholarly Papers (11)

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1.

Kinetics of Cu6sn5 and Cu3sn Intermetallic Compounds Growth and Isothermal Solidification During Cu-Sn Transient Liquid Phase Sintering Process

Number of pages: 17 Posted: 23 Dec 2022
Xianwen Peng, Yue Wang, Wanli Wang, Zheng Ye, Jian Yang and jihua huang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 80 (830,555)

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Cu-Sn Intermetallic Compounds, kinetics, Growth, Isothermal Solidification, TLPS Process

2.

Influence of Interfacial Structure on Bonding Strength and Thermoelectric Transport Properties of Cu 6 Sn 5 /Cu Interface

Number of pages: 27 Posted: 20 Mar 2022
Zhihang Zhang, Qiuguo Yang, Jihua Huang, Shuhai Chen, Zheng Ye and Jian Yang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 48 (1,121,190)
Citation 4

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Interfacial structure, Bonding strength, Thermoelectric transport properties, First-principle calculation, Semi-classical Boltzmann transport theory

3.

High Strength Low Alloy Steel Joint Fabricated by Laser Welding with Real-Time High-Frequency Resistance Heating

Number of pages: 26 Posted: 16 Dec 2023
Zheng Ye, Wanli Wang, Jian Yang and jihua huang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 43 (1,157,785)

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HSLA, Microstructure, mechanical properties, Heat input, grain size

4.

Comprehensive Enhancement of Mechanical Strength, Thermal Conductivity, and Oxidation Resistance of W/Cu Diffusion Bonding Joint Via Heterogeneous Interface Configuration Design

Number of pages: 67 Posted: 12 May 2025
Zida Wang, Jinghao Xu, Qi Wu, Shuwen Shang, Wei Shao, Jihua Huang, Shuhai Chen, Zheng Ye, Wanli Wang and Jian Yang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, Warsaw University of Technology, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 42 (1,183,237)

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First-principles calculation, Heterogeneous interface, mechanical strength, thermal conductivity, Diffusion energy barrier, Oxidation resistance.

5.

Influence of Interfacial Configuration on Bonding Properties and Thermal Conductivity of Heterogeneous Interface in Al/Graphite Composite Used for Electronic Packaging

Number of pages: 28 Posted: 08 Aug 2022
Qiuguo Yang, Jihua Huang, Shuhai Chen, Zheng Ye, Wanli Wang and Jian Yang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 41 (1,183,237)
Citation 1

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Interfacial configuration, Bonding properties, Thermal conductivity, Deformation potential theory, First-principles calculation

6.

Ni-Alloyed Cu@Sn Core-Shell Powders Enabling Highly efficient and reliable Cu-Cu TLPS bonding: Ni-Accelerated Cu6Sn5 Growth with Concomitant Cu3Sn Inhibition

Number of pages: 25 Posted: 29 Dec 2025
Wanli Wang, Xianwen Peng, Zheng Ye, Wanli Wang and jihua huang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 26 (1,372,601)

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TLPS bonding, Core/shell powder, Microstructural evolution, Mechanical property, Thermal stability

7.

Microstructural Mechanism and Process Kinetics of Reaction-Composite Diffusion Brazing of Cf/Sic Composite and Gh3044 Alloy with (Cu-Ti)+C+Ni Interlayer

Number of pages: 32 Posted: 17 Dec 2022
Wanli Wang, Zhihang Hou, Zheng Ye, Jian Yang and jihua huang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 23 (1,411,822)

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Ceramic-matrix composites (CMCs), superalloy, Joining, Stress relaxation, Heat-resistance

8.

Interface Strengthened Brazing of Carbon/Carbon Composite and Gh3044 Alloy Via Inserting W Fibers

Number of pages: 26 Posted: 12 Dec 2022
Wanli Wang, Duohuan Niu, Zheng Ye, Jian Yang and jihua huang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 23 (1,411,822)

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C/C composite, GH3044 alloy, joining interface, W fiber

9.

Multi-Angle Investigation on the Improvement of Mechanical Property of 93wnife/Nifewss Interlayer/30crmnsia Steel Hot Isostatic Pressing Diffusion Bonding Joints: Experiment, Finite Element Simulation and Diffusion-Precipitation Kinetics Analysis

Number of pages: 68 Posted: 09 Apr 2025
Jinghao Xu, Zida Wang, Qi Wu, Zhihang Zhang, Wei Shao, Jihua Huang, Shuhai Chen, Zheng Ye, Wanli Wang and Jian Yang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, Warsaw University of Technology, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 19 (1,481,165)

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mechanical engineering, HIP diffusion bonding joints, Steel/tungsten, Overload brittle fracture, Stress distribution, Diffusion-precipitation kinetics

10.

A Novel Stress-Relaxing Approach Based on Forming Fe-Ni Invar Effect Interlayer for Joining C/C Composites

Number of pages: 14 Posted: 21 Feb 2023
Wanli Wang, Zhihang Hou, Zheng Ye, Jian Yang and jihua huang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 16 (1,491,251)

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C/C composite, Joining, Fe-Ni invar alloy, Interlayer, Stress-relaxing

11.

In-situ reaction compositing behavior of the Ni62Ti38+C interlayer and its effects on interfacial microstructure and mechanical properties of the Cf/C-GH3044 joint

Number of pages: 47 Posted: 28 Aug 2025 Last Revised: 14 Dec 2025
Wanli Wang, Yuxin Hui, Zhecheng Jiang, Zhihang Hou, Zheng Ye, Jian Yang, Shuhai Chen and jihua huang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 13 (1,526,714)

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Cf/C composite, GH3044 superalloy, Reactive composite brazing, C/Ti in-situ reaction