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Xianwen Peng

University of Science and Technology Beijing

30 Xueyuan Road, Haidian District

beijing, 100083

China

  • University of Science and Technology Beijing

SCHOLARLY PAPERS

2

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106

TOTAL CITATIONS

0

Scholarly Papers (2)

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1.

Kinetics of Cu6sn5 and Cu3sn Intermetallic Compounds Growth and Isothermal Solidification During Cu-Sn Transient Liquid Phase Sintering Process

Number of pages: 17 Posted: 23 Dec 2022
Xianwen Peng, Yue Wang, Wanli Wang, Zheng Ye, Jian Yang and jihua huang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 80 (830,555)

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Cu-Sn Intermetallic Compounds, kinetics, Growth, Isothermal Solidification, TLPS Process

2.

Ni-Alloyed Cu@Sn Core-Shell Powders Enabling Highly efficient and reliable Cu-Cu TLPS bonding: Ni-Accelerated Cu6Sn5 Growth with Concomitant Cu3Sn Inhibition

Number of pages: 25 Posted: 29 Dec 2025
Wanli Wang, Xianwen Peng, Zheng Ye, Wanli Wang and jihua huang
University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing, University of Science and Technology Beijing and University of Science and Technology Beijing
Downloads 26 (1,372,601)

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TLPS bonding, Core/shell powder, Microstructural evolution, Mechanical property, Thermal stability