polymeric composite, thermal conductive network, interface thermal resistance, thermal conductivity, dielectric properties
black phosphorene, carboxymethyl chitosan, composite film, flame retardancy, thermal conductivity
dynamic disulfide bonds, shrinkage, Gauss type radial distribution
black phosphorus, molybdenum diboride, flame retardancy, fast response.
Thermal conductivity, Heterostructure-based fillers, Interface thermal resistance, Polymer-matric composites
organosilicon resin, poly (benzoxazine), low dielectric, anti-corrosion, biomimetic structure
MXene, PS nanospheres, Electrostatic interaction, Thermal conductivity, flame retardant
black phosphorus, plasma cleaning, Flame retardancy, epoxy resin
Bio-based, dynamic covalent crosslinking network, low dielectric, Sustainability, multi-coupling modification