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Hui Yang

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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60

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0

Scholarly Papers (2)

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1.

High-Efficiency Improvement of Thermal Conductivity for Polydimethylsiloxane Composites from Fabricated Sesame Cracker-Like Hetero-Structured Fillers Based on In-Situ Welding

Number of pages: 32 Posted: 21 Nov 2023
Xiaole Zheng, Kun Wu, Yingjie Zhan, Hui Yang, Guoming Yuan, Junxi Wan and Jun Shi
affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Guangzhou Institute of Chemistry, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Guangzhou Institute of Chemistry, Yulin Normal University and affiliation not provided to SSRN
Downloads 32 (1,290,922)

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Thermal conductivity, Heterostructure-based fillers, Interface thermal resistance, Polymer-matric composites

2.

Magnolol-Derived Organosilicon Composite On the Surface of Biomimetic Cattail Leaf with Excellent Low Dielectric and Anti-Corrosion Properties

Number of pages: 32 Posted: 08 Apr 2025
Guoming Yuan, Hui Yang, Zhijun Liu, Haoting Zheng, Yanhan Tao, Bo Yang, Kun Wu and Jun Shi
Chinese Academy of Sciences (CAS) - Guangzhou Institute of Chemistry, affiliation not provided to SSRN, affiliation not provided to SSRN, Institute of Corrosion Science and Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Guangzhou Institute of Chemistry and affiliation not provided to SSRN
Downloads 28 (1,359,097)

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organosilicon resin, poly (benzoxazine), low dielectric, anti-corrosion, biomimetic structure