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Ja Eung Koo

Samsung Electronics Co., Ltd.

Suwon

Korea, Republic of (South Korea)

  • Samsung Electronics Co., Ltd.

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Scholarly Papers (1)

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Origins of Wear-Induced Tungsten Corrosion Defects in Semiconductor Manufacturing During Tungsten Chemical Mechanical Polishing

Number of pages: 29 Posted: 22 Apr 2022
Seung-Hoon Choi, Melissa E. Kreider, Adam C. Nielander, Michaela Burke Stevens, Gaurav Ashish Kamat, Ja Eung Koo, Ki Ho Bae, Hoyoung Kim, Il Young Yoon, Bo Un Yoon, Kihyun Hwang, Dong Un Lee and Thomas F. Jaramillo
Stanford University, Stanford University, Stanford University, Stanford University, Stanford University, Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Co., Ltd., Stanford University and Stanford University
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Abstract:

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Chemical mechanical polishing, tungsten, Corrosion, CMOS integrated circuit, contact plug, inductively coupled plasma mass spectrometry