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Tiwei Wei

Purdue University

610 Purdue Mall

West Lafayette, IN INDIANA 47907

United States

  • Purdue University

SCHOLARLY PAPERS

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Scholarly Papers (1)

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Porosity-Tunable LPBF Copper Wicks Directly Printed on Silicon for High-Heat-Flux Cooling: Thermal, Mechanical, and Reliability Characteristics as a Function of Laser Processing Conditions

Number of pages: 37 Posted: 03 Dec 2025
Scott Schiffres, Harish Kumar Lattupalli, Emily M. Stallbaumer-Cyr, Ketankumar Jayantkumar Yogi, Sina Ghadi, Stephen Cain, Lan Yao and Tiwei Wei
Binghamton University, affiliation not provided to SSRN, Minnesota State University Mankato, Purdue University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Purdue University
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Abstract:

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Laser Powder Bed Fusion (LPBF), Porous Copper Wick, Direct-to-Chip Integration, Two-Phase Cooling, Thermal Interface Materials (TIMs) Elimination.