default author photo

Harish Kumar Lattupalli

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

DOWNLOADS

111

TOTAL CITATIONS

0

Scholarly Papers (2)

Actions:
Email selected abstracts
1.

Porosity-Tunable LPBF Copper Wicks Directly Printed on Silicon for High-Heat-Flux Cooling: Thermal, Mechanical, and Reliability Characteristics as a Function of Laser Processing Conditions

Number of pages: 37 Posted: 03 Dec 2025
Scott Schiffres, Harish Kumar Lattupalli, Emily M. Stallbaumer-Cyr, Ketankumar Jayantkumar Yogi, Sina Ghadi, Stephen Cain, Lan Yao and Tiwei Wei
Binghamton University, affiliation not provided to SSRN, Minnesota State University Mankato, Purdue University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Purdue University
Downloads 75 (924,743)

Abstract:

Loading...

Laser Powder Bed Fusion (LPBF), Porous Copper Wick, Direct-to-Chip Integration, Two-Phase Cooling, Thermal Interface Materials (TIMs) Elimination.

2.

Laser Powder Bed Fusion of Sn-Al Multimaterial Pin-Fin Heat Sinks on Silicon Wafer for Electronic Heat Dissipation

Number of pages: 25 Posted: 24 Apr 2026
Andrea Mistrini, Amin Hodaei, Stefano Mangiarotti, Harish Kumar Lattupalli, Martina Meisnar, Jussi Hokka, Davoud Jafari and Riccardo Casati
affiliation not provided to SSRN, University of Twente, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Twente and Polytechnic University of Milan
Downloads 36 (1,448,301)

Abstract:

Loading...

Laser Powder Bed Fusion, Metallic Thermal Interface Material, Wafer-Scale Additive Manufacturing on Silicon, Heat Sink Integration, thermal management, Microelectronics